Cooling for AI-class and Mission-Critical Systems.
ThermaFlux-X is a proprietary dielectric thermal fluid engineered to deliver high heat-transfer performance, low pumping losses, and electrical isolation in next-generation compute and electronics environments.
Performance snapshot
Key properties defined for data-center, defense, and industrial electronics cooling.
1.0 W/m·K
Thermal conductivity
1.3 cP
Low viscosity
215°C
Thermal ceiling
10⁻¹¹ S/m
Elec. conductivity
Purpose-built for high-density cooling
Conventional water and glycol loops were not designed to operate adjacent to energized electronics, high-voltage buses, or 100+ kW racks. ThermaFlux-X addresses this gap with a fluid architecture defined to combine thermal performance with dielectric safety.
Specific formulation details are confidential. A full technical dossier, test plan, and system integration guide are available under NDA for OEMs, operators, and qualified research partners.