Technical Performance Envelope

The following properties represent the target design envelope for ThermaFlux-X in high-density, liquid-to-device cooling architectures. Detailed test data, system-level integration notes, and validation plans are provided only under NDA.

Thermal conductivity

1.0 W/m·K

Defined to exceed common glycol/water solutions used in IT cooling.

Viscosity

~1.3 cP

Supports lower pump energy and higher flow in confined channels.

Thermal ceiling

≈ 215°C

Wide thermal window for elevated inlet temperatures and heat rejection strategies.

Electrical conductivity

1 × 10⁻¹¹ S/m

Dielectric characteristics support operation near energized electronics.

Dielectric strength

> 15 kV/mm

For applications in high-voltage or high-power electronics proximity.

Operating range

–40°C to 215°C

Supports cold ambient start and high-temp AI racks.

Confidential formulation

Composition, dispersion approach, and lifecycle additives are part of a confidential program. OEMs, hyperscale operators, and strategic labs may request access to the full package under a mutual NDA. Field-of-use licensing is available.