Use cases
ThermaFlux-X is defined for high-density, high-voltage, or mission-critical environments where conventional water/glycol fluids are not acceptable due to electrical or thermal constraints.
AI / GPU Data Centers
Supports 100–135 kW racks, warm water inlet strategies, and proximity to energized components.
Direct-to-Chip Cooling
Low viscosity for high-flow channels and CDUs with minimized pumping overhead.
Immersion & Edge
Dielectric characteristics enable sealed, remote, or containerized deployments.
Aerospace / Avionics
For high-altitude or radar electronics demanding electrical isolation and thermal headroom.
Defense / Rugged Electronics
Handles thermal cycling, vibration, and high-power electronics in mobile platforms.
Automotive / Motorsport
Thermal management for compact, high-voltage powertrains and inverters.
High-Power DC Motors
Cools high-current motors while maintaining electrical isolation to protect windings and insulation.
Semiconductor Equipment
For precision tools where a non-conductive coolant mitigates arc/contamination risk.
Medical / Imaging
MRI/X-ray power modules and other high-power electronics needing cooling + dielectric safety.
Quantum / Cryogenic Infra
Supports low-temp operation while maintaining electrical isolation for sensitive electronics.
Industrial Automation
High-duty drives, converters, and control electronics in production environments.
Telecom / Energy Storage
Extends life of rectifiers and BESS systems through non-conductive thermal management.